|
|
| Company Profile |
ConnectCounty Holdings Berhad
was incorporated in 1994 and consists of a group of high
tech cable/connector manufacturing companies. The Group
has four subsidiaries with production concentrated in cost
effective global locations such as China and Malaysia while
technical and customer service supported are locally:
|
ConnectCounty
Sdn Bhd (Malacca, Malaysia)
ConnectCity
(S) Pte Ltd (Singapore)
Rapid Conn
Co., Ltd (Shenzhen, China) |
Microconn
Co., Ltd (Shenzen, China)
Rapid Conn,
Inc. (CA, USA) and
a |
Principal Business:
,Design & Development of customized, Value-added &
Industry Standard Cables & Connectors
,Manufacturing
,Sales & Marketing
,Complete Program Management |
Principal Markets:
,Broadband Telecommunication
,Audio & Video Entertainment Equipment
,Computers peripherals and Mass Storage Industries.
,Medical Equipment
,Mobilephone and PDAs |
Our US subsidiary,
Rapid Conn Inc. provides us access to the electronic industry¨s
committees and technology decision makers.
Our indigenous automation capability is another add-on advantage
to our manufacturing facility. We design and fabricate automated
machines to facilitate consistent production quality, cost
competitiveness and consistent output.
By capitalizing on the strength and experience of its product
R & D and related automation techniques and design,
the Group provides value-added and customized product mix
solutions for customers that encompass conceptualization,designing,
prototyping, fabrication, testing, design patenting, manufacturing
and logistic integration.
The over-molding capabilities and experience in both Malacca
and Shenzhen provide full range manufacturing every variety
of over-molded cable such as USB, RCA, S-Video and etc.
Full range of testing is available in-house including:
,Electrical Continuity and Contact Resistance
,Dielectric Withstanding Voltage (DWV) and Insulation Resistance
,Thermal Shock and Cycling
,Corrosive Atmosphere and Humidity
,Solderbility
,Tensile Strength and Force Deflection Analysis
,Mold Flow and Finite Element Analysis
,Plating Thickness and Durability Analysis
|
|
|