English | 嶄猟井
 
 

 

 
 

Member of Connect County Group of Companies

 
COMPANY PROFILE
Major
Milestones
Sales
Offices
ConnectCounty
Sdn Bhd
Microconn
Co Ltd
ConnectCity(S)
Pte Ltd
Rapid Conn
Inc
Rapid Conn
Co.,Ltd
 Company Profile

ConnectCounty Holdings Berhad was incorporated in 1994 and consists of a group of high tech cable/connector manufacturing companies. The Group has four subsidiaries with production concentrated in cost effective global locations such as China and Malaysia while technical and customer service supported are locally:

ConnectCounty Sdn Bhd (Malacca, Malaysia)
ConnectCity (S) Pte Ltd (Singapore)
Rapid Conn Co., Ltd (Shenzhen, China)
Microconn Co., Ltd (Shenzen, China)
Rapid Conn, Inc. (CA, USA) and
a
Principal Business:
,Design & Development of customized, Value-added & Industry Standard Cables & Connectors
,Manufacturing
,Sales & Marketing
,Complete Program Management
Principal Markets:
,Broadband Telecommunication
,Audio & Video Entertainment Equipment
,Computers peripherals and Mass Storage Industries.
,Medical Equipment
,Mobilephone and PDAs

Our US subsidiary, Rapid Conn Inc. provides us access to the electronic industry¨s committees and technology decision makers.

Our indigenous automation capability is another add-on advantage to our manufacturing facility. We design and fabricate automated machines to facilitate consistent production quality, cost competitiveness and consistent output.

By capitalizing on the strength and experience of its product R & D and related automation techniques and design, the Group provides value-added and customized product mix solutions for customers that encompass conceptualization,designing, prototyping, fabrication, testing, design patenting, manufacturing and logistic integration.

The over-molding capabilities and experience in both Malacca and Shenzhen provide full range manufacturing every variety of over-molded cable such as USB, RCA, S-Video and etc.

Full range of testing is available in-house including:
,Electrical Continuity and Contact Resistance
,Dielectric Withstanding Voltage (DWV) and Insulation Resistance
,Thermal Shock and Cycling
,Corrosive Atmosphere and Humidity
,Solderbility
,Tensile Strength and Force Deflection Analysis
,Mold Flow and Finite Element Analysis
,Plating Thickness and Durability Analysis

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